事业部项目相关的所有工作, 包括但不限于：
1.端到端的客户设计服务项目相关活动
2.为客户准备技术和封装解决方案的资料
3.支持项目顺利执行
4.与全球设计服务团队、工厂团队和研发线一起合作项目提升客户的满意度
5.分析市场动态，国内外IC设计公司和OEM终端客户

BU project operation related tasks, include but not limit to:
1.End-to-end customer project related activities of the design services
2.Prepare documentation of technology and package solution promotion to customer
3.Supports the project smooth ｅｘｅｃution
4.Improve customer’s satisfactions in quick response and quality communications, coordinate with worldwide design service functional teams, factory teams and RnD pilot lines
5.Analyzes the market dynamics and business of the IC design houses as well as OEM end customers domestically or overseas

This position shall be located in Shanghai.
Qualifications
1、BS degree or higher with technical background / business interests is a plus.Major in materials, chemical engineering, packaging, etc
2、Basic semiconductor packaging knowledge such as assembly processes and package design.
3、Excellent communication skills to help win and support customers’ projects smoothly through collaboration with internal cross-functional teams and/or factories.
4、Knowledge of fundamental mechanical, thermal or electrical.
5、Attention to details.
6、Result oriented, always begin with end in mind.
7、Great people’s skills.
8、Skilled for simulation tool of Ansys, Abacus, programing capability is bonus point.

专业要求：不限